EUROLINIA TCEI-2 Ceramic-polymer thermally conductive films are dielectric thin-film silicone elastomers available in a range of electric insulating power, thickness, and thermal conductivities up to 1.4 W/m°K.
Made in thin elastic gaskets, these films help extend the life of semiconductor devices and reduce their assembly time and weight.
Key Features and Performance Specs
Heat conductive thin films are usually placed in between a source of heat such as a microprocessor chip and a heat sink or chassis. This highly conformable thermal interface material provides electrical insulation and effectively eliminates air gaps that exist between these components. Tighter contact between the surfaces significantly improves heat dissipation by the heat sink.
Recommended for applications with operating temperatures ranging from -60°C to +250°C.
Heat conductive thin films are usually placed in between a source of heat such as a microprocessor chip and a heat sink or chassis. This highly conformable thermal interface material provides electrical insulation and effectively eliminates air gaps that exist between these components. Tighter contact between the surfaces significantly improves heat dissipation by the heat sink.
- Natural elasticity and thermal conductivity, low thickness, and durability ensure minimal thermal resistance and reliable electrical insulation.
- It allows the assembly of heat-emitting electronic components without having to apply thermal greases, which guarantees reliability and electrical safety and also reduces the assembly time.
- Fiberglass reinforcement prevents mechanical damage of the film under strong compression between the surfaces of the device and the heat sink. Up to 40 MPa compression does not damage the medium. At the same time, a thermally conductive elastic silicone base fills the unevenness of the compressing surfaces, increasing heat transfer.
- Our heat conductive thin films do not emit harmful substances during application and operation, are non-toxic, and resistant to substances used when cleaning PCBs.
- For easier application, the film is coated with a sticky adhesive layer or sticky positioning grease. Sticky positioning grease has low adhesive shear strength, allowing the film gasket to be moved slightly over the surface with little effort.
TCEI-2 thermally conductive insulating thin sheets TCEI-2 thermally conductive insulating gaskets TCEI-2 thermally conductive insulating thin film
EUROLINIA TCEI-2 thermal conductivity thin films provide effective heat dissipation and electrical insulation due to the strong heat-conducting and dielectric properties of ceramic fillers, high thermal relaxation, and conforming to the applied surfaces.
These films are manufactured and supplied in 160 mm width and up to 780 mm length rectangular sheets, as well as in the shape of gaskets cut out from the TCEI-2 sheets according to the customer’s drawings.
Standard TCEI-2 sheet (gaskets) thickness is 0.15, 0.20, 0.25, 0.30, 0.45, 0.50, 0.75, 1.00, 1.50, 2.00 mm. Standard sheet sizes are 150×100 mm, 150×130 mm, 150×220 mm, 160×220 mm, 160×260 mm. Custom sheets and gaskets dimensions and shapes are available upon a customer’s request.
EUROLINIA Heat Conductive Thin Films Line
- TCEI-2/1 films are produced by filling the silicone base with highly purified Oxide Ceramic micro powders, recrystallized using a special technology at temperatures above 2000 ºС (α-Crystalen™).
- TCEI-2/2 films are based on Oxide and Nitride ceramic micro powders sintered in a highly purified Nitrogen environment using a unique technology at temperatures above 1200 °C (β-Crystalen™).
- TCEI-2/3 films are made of Nitride Ceramic micro powders.
- TCEI-2/1-VN films are made by filling the silicone base with regular spherical shape particles of highly Purified Oxide Ceramic micro powders, which is an extremely high thermal conductivity recrystallized medium.
- TCEI-2/2-VN films are made by filling the silicone base with regular spherical shape particles of highly Purified Oxide Ceramic micro powders mixed with fractions of Oxide and Nitride Ceramic micro powders sintered in an environment of highly purified Nitrogen using a unique technology at temperatures above 1200 °C (β-Crystalline™).
Production process
TCEI-2 heat conductive sheets are manufactured by the step-by-step contact injection molding method. As a result, the sheet film appears as a tightly composited structure of uniform thickness with a smooth and even surface.
High-performance properties of the EUROLININA thermal conductivity thin films are achieved by using the following techniques:
- Filling the rubber base with an optimal combination of various heat-conducting ceramic filler micro powders.
- Use of specially developed heat-conducting dielectric α-Cristalen™, β-Cristalen™ micro powder fractions of regular spherical shape Oxide Ceramics, as well as various fractional composition Nitride Ceramics.
- Production of homogeneous in thickness tightly composited medium structure without internal gas cavities.
- Use of thin reinforcing electrical insulating fiberglass base.
- Sheet surface glossy calibration technology to achieve maximum conformity of the contacting surfaces.
Product Specifications
When operating at high temperatures the TCEI-2 thermal conductivity thin films have the following life span:
- No less than 2,500 hours at 200°С
- No less than 1,500 hours at 250°С
General life expectancy: more than 10 years.
EUROLINIA TCEI-2 Product Specs
| Property | |||
|---|---|---|---|
| Product name | |||
| TCEI-2/1 | TCEI-2/2 | TCEI-2/3 | |
| Appearance | Elastic rubber-like homogeneous sheet | ||
| Color | pink, gray(¹) | brown, gray(¹) | Gray |
| Density, g/cm³ | 2,05-2,20 | 1,90-2,10 | 1,80-2,00 |
| Durometer Shore A | 70-90 | ||
| Thickness, mm | от 0,15 до 2,0 | ||
| Stickiness (²), N/m | 100 | ||
| Nominal working compressive stress, MPa | 3,5 | ||
| Maximum working compressive stress, MPa | 20 | ||
| Maximum compression ratio (elasticity),% | 50 | ||
| Dielectric Strength, KV/mm: | |||
| – D.C. | 25 | 20 | 15 |
| – A.C. | 18 | 15 | 10 |
| Volume Resistivity, Ohm•cm | 1014 | 1013 | 1012 |
| Dielectric Constant at 1,000Hz | 6,5 | ||
| Dielectric loss tangent at 1,000Hz | 0,0045 | ||
| Thermal conductivity, W/(m•К) | 0,80 | 1,10 | 1,40 |
| Specific thermal resistance, (K•cm²)/W, with a sheet thickness of 0.20 ± 0.02 mm and a compression pressure of 0.69 MPa (100 psi) | |||
| – original sheet material | 3,10 | 2,70 | 2,30 |
| – material with adhesive or positioning grease | 2,80 | 2,50 | 2,00 |
| (¹) – Any custom color is available according to the customer’s request | |||
| (²) – This value is defined only for the films with a sticky adhesive layer | |||
EUROLINIA TCEI-2VN Product Specs
| Property | |||
|---|---|---|---|
| Product name | |||
| TCEI-2/1VN | TCEI-2/2VN | ||
| Appearance | Elastic rubber-like homogeneous sheet | ||
| Color | pink, gray(¹) | brown, gray(¹) | |
| Density, g/cm³ | 2,75-2,85 | 2,60-2,65 | |
| Durometer Shore A | 70-90 | ||
| Thickness, mm | от 0,25 до 2,0 | ||
| Stickiness (²), N/m | 100 | ||
| Nominal working compressive stress, MPa | 4,0 | ||
| Maximum working compressive stress, MPa | 25 | ||
| Maximum compression ratio (elasticity),% | 50 | ||
| Dielectric Strength, KV/mm: | |||
| – D.C. | 25 | 20 | |
| – A.C. | 18 | 15 | |
| Volume Resistivity, Ohm•cm | 1014 | 1013 | |
| Dielectric Constant at 1,000Hz | 6,5 | ||
| Dielectric loss tangent at 1,000Hz | 0,0045 | ||
| Thermal conductivity, W/(m•К) | 2,0 | 2,5 | |
| Specific thermal resistance, (K•cm²)/W, with a sheet thickness of 0.25 ± 0.02 mm and a compression pressure of 0.69 MPa (100 psi) | |||
| – original sheet material | 2,20 | 1,90 | |
| – material with adhesive or positioning grease | 1,80 | 1,60 | |
| (¹) – Any custom color is available according to the customer’s request | |||
| (²) – This value is defined only for the films with a sticky adhesive layer | |||
Typical Gasket Thermal Conductive Properties
| Vendor code | Shape | Heat transfer surface, cm² | Gasket thickness, mm | Thermal resistance, K/W, at 0.69 MPa (100 psi) compression stress, standard / with a sticky layer | ||
|---|---|---|---|---|---|---|
| Product name | ||||||
| TCEI-2/1 | TCEI-2/2 | TCEI-2/3 | ||||
| 2K4229 (ТО-3) |  |
7,99 | 0,20 0,30 0,50 1,00 1,50 2,00 |
0,39/0,35 0,53/0,50 0,83/0,79 1,54/1,50 2,26/2,22 2,98/2,94 |
0,34/0,31 0,45/0,42 0,67/0,64 1,22/1,19 1,77/1,74 2,32/2,23 |
0,29/0,25 0,38/0,34 0,55/0,51 0,99/0,95 1,42/1,38 1,86/1,82 |
| 2K3521 (ТО-66) |  |
5,00 | 0,20 0,30 0,50 1,00 1,50 2,00 |
0,63/0,57 0,86/0,79 1,32/1,25 2,47/2,40 3,62/3,55 4,77/4,70 |
0,55/0,50 0,72/0,68 1,08/1,03 1,95/1,90 2,83/2,78 3,71/3,66 |
0,47/0,41 0,60/0,54 0,88/0,82 1,58/1,52 2,27/2,21 2,97/2,91 |
| 2K2520 (ТО-3Р) |  |
4,90 | 0,20 0,30 0,50 1,00 1,50 |
0,64/0,58 0,88/0,81 1,35/1,28 2,52/2,45 3,69/3,63 |
0,56/0,51 0,74/0,69 1,10/1,05 1,99/1,94 2,89/2,84 |
0,47/0,41 0,62/0,56 0,90/0,84 1,61/1,55 2,37/2,26 |
| 2K2318 (ТО-218, ТО-247) |  |
4,04 | 0,20 0,30 0,50 1,00 1,50 |
0,78/0,70 1,06/0,98 1,63/1,55 3,05/2,98 4,48/4,40 |
0,68/0,62 0,90/0,84 1,33/1,27 2,42/2,36 3,50/3,44 |
0,58/0,50 0,75/0,67 1,09/1,02 1,95/1,88 2,81/2,73 |
| 2K1813 (ТО-220) |  |
2,26 | 0,20 0,30 0,50 1,00 |
1,39/1,25 1,90/1,76 2,92/2,78 5,46/5,32 |
1,21/1,11 1,60/1,50 2,38/2,27 4,32/4,21 |
1,03/0,90 1,34/1,20 1,95/1,82 3,49/3,35 |
| 2K1310 (ТО-126) |  |
1,22 | 0,20 0,30 0,50 1,00 |
2,58/2,31 3,52/3,26 5,40/5,14 10,11/9,85 |
2,25/2,05 2,97/2,77 4,40/4,21 8,00/7,80 |
1,91/1,66 2,48/2,23 3,61/3,37 6,46/6,21 |
| 2D25,4х6,5 (DО-5) |  |
4,74 | 0,20 0,30 0,50 1,00 |
0,66/0,60 0,91/0,84 1,39/1,32 2,60/2,54 |
0,58/0,53 0,76/0,71 1,13/1,08 2,06/2,01 |
0,49/0,43 0,64/0,57 0,93/0,87 1,66/1,60 |
| 2D16х5 (DО-4) |  |
1,81 | 0,20 0,30 0,50 1,00 |
1,74/1,56 2,37/2,19 3,64/3,47 6,82/6,64 |
1,52/1,38 2,00/1,87 2,97/2,84 5,39/5,26 |
1,28/1,12 1,67/1,50 2,44/2,27 4,35/4,19 |
Directions for Use
Picture 1 
Picture 2
Operation of gaskets made of TCEI-2 materials when exceeding the maximum compression stress is not allowed.
- Before using the TCEI-2 thermal conductivity thin films and derivative products (gaskets and substrates), remove the protective polymer film from the surface of the medium.
- Nominal compressive stress (MPa) defines the permissible relative deformation of a sheet of material in the range from 10% to 50% of its original thickness.
- Maximum compressive stress determines the relative deformation of the material within up to 50% of its original thickness at which there is no loss of elasticity. When the compressive stress is removed, the material is restored to its original thickness and retains its properties.
- The roughness of the contacting surfaces should not exceed Ra = 0.63 μm. Burrs and other defects of the contact surfaces can compromise the integrity of the gasket and the electrical insulation. The efficiency of heat removal through a gasket made of TCEI-2 film is determined by:
- The compressive force of the surfaces of the device and the heat sink;
- Surface flatness and parallelism during assembly;
- Residual air cavities between the gasket and the contacting surfaces;
- To effectively remove the air cavities, it is recommended to apply the gasket with a glossy surface (sticky side) to the highest quality surface and treat it with a rubber roller.
- To insulate semiconductor devices from the heatsink body when fixing with screws, use the M2.5 and M3 insulating sleeves made of heat-resistant polyamide (see Picture 1).
- When using 20 to 1200 cm² large gaskets, it is often difficult to properly prepare the contact surfaces. In such cases, the gasket thickness and elasticity are not enough to compensate for the defects of the surfaces, as well as their flatness and parallelism during the compression. However, increasing the thickness of the gasket leads to an increase in thermal resistance. To avoid this, it is first recommended to apply the heat-conducting paste TCEI-3 onto the contacting surfaces and then install the gasket.
- Storing, and using the TCEI-2M materials at temperatures below – 60 °C and above + 250 °C is prohibited.
Manufacturer’s Warranty
- The manufacturer guarantees the compliance of the TCEI-2 compounds with the declared above product technical specifications, subject to proper conditions of transportation, storage, and use.
- Stored in the manufacturer’s package TCEI-2 without tacky layer shelf life: 24 months from the manufacture date.
- Stored in the manufacturer’s package TCEI-2 with tacky layer shelf life: 6 months from the manufacture date.
- Loss of TCEI-2 heat conductive thin film tackiness after the shelf life expiration is not considered to be a defective product.
- After the shelf life expiry, the TCEI-2 film should be tested before each use for compliance with the technical requirements. Subject to compliance, the TCEI-2 film can be used for its intended purpose.
- Quality complaints and claims are accepted when returning the products in the manufacturer’s container with the provision of accompanying documents for the products received from the manufacturer.
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